Surface Mount  

YES

Number of Terminals  

176

Rohs Code  

Yes

Part Life Cycle Code  

Active

Ihs Manufacturer  

STMICROELECTRONICS

Package Description  

VFBGA,

Clock Frequency-Max  

50 MHz

Number of I/O Lines  

140

Operating Temperature-Max  

105 °C

Operating Temperature-Min  

-40 °C

Package Body Material  

PLASTIC/EPOXY

Package Code  

VFBGA

Package Shape  

SQUARE

Package Style  

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM(byte)  

327680

ROM(word)  

1048576

Supply Voltage-Max  

3.6 V

Supply Voltage-Min  

3.3 V

Supply Voltage-Nom  

3.3 V

ECCN Code  

3A991.A.2

Additional Feature  

UFBGA (176+25) PACKAGE; IT IS ALSO HAVING DCMI, SDMMC, SPDIFRX(4) CONNECTIVITY

HTS Code  

8542.31.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

JESD-30 Code  

S-PBGA-B176

Temperature Grade  

INDUSTRIAL

Speed  

200 MHz

uPs/uCs/Peripheral ICs Type  

MICROCONTROLLER, RISC

Bit Size  

32

Has ADC  

YES

DMA Channels  

YES

PWM Channels  

YES

DAC Channels  

YES

Seated Height-Max  

0.6 mm

On Chip Program ROM Width  

8

Boundary Scan  

NO

ROM Programmability  

FLASH

Length  

10 mm

Width  

10 mm