Surface Mount  

YES

Number of Terminals  

56

Rohs Code  

Yes

Part Life Cycle Code  

Transferred

Ihs Manufacturer  

XILINX INC

Part Package Code  

BGA

Package Description  

6 X 6 MM, 0.50 MM PITCH, CSP-56

Clock Frequency-Max  

213 MHz

Moisture Sensitivity Levels  

3

Number of I/O Lines  

45

Operating Temperature-Max  

70 °C

Package Body Material  

PLASTIC/EPOXY

Package Code  

LFBGA

Package Equivalence Code  

BGA56,10X10,20

Package Shape  

SQUARE

Package Style  

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max  

1.9 V

Supply Voltage-Min  

1.7 V

Supply Voltage-Nom  

1.8 V

JESD-609 Code  

e1

Pbfree Code  

Yes

Terminal Finish  

TIN SILVER COPPER

Additional Feature  

FAST ZERO POWER DESIGN TECHNOLOGY

HTS Code  

8542.39.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Terminal Pitch  

0.5 mm

Reach Compliance Code  

compliant

Time@Peak Reflow Temperature-Max (s)  

30

Pin Count  

56

JESD-30 Code  

S-PBGA-B56

Number of Outputs  

45

Qualification Status  

Not Qualified

Temperature Grade  

COMMERCIAL

Propagation Delay  

4 ns

Architecture  

PLA-TYPE

Number of Inputs  

45

Organization  

0 DEDICATED INPUTS, 45 I/O

Seated Height-Max  

1.35 mm

Programmable Logic Type  

FLASH PLD

Output Function  

MACROCELL

Number of Macro Cells  

64

Length  

6 mm

Width  

6 mm