Surface Mount  

YES

Number of Terminals  

169

Rohs Code  

Yes

Part Life Cycle Code  

Active

Ihs Manufacturer  

STMICROELECTRONICS

Part Package Code  

BGA

Package Description  

9 X 9 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, TFBGA-169

Operating Temperature-Max  

85 °C

Operating Temperature-Min  

-40 °C

Package Body Material  

PLASTIC/EPOXY

Package Code  

TFBGA

Package Shape  

SQUARE

Package Style  

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Nom  

1.2 V

HTS Code  

8542.39.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Pin Count  

169

JESD-30 Code  

S-PBGA-B169

Temperature Grade  

INDUSTRIAL

Seated Height-Max  

1.2 mm

Telecom IC Type  

RF FRONT END CIRCUIT

Length  

9 mm

Width  

9 mm