Surface Mount  

NO

Material  

aluminium

Housing material  

polyethylene

Number of Terminals  

8

Rohs Code  

No

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

NATIONAL SEMICONDUCTOR CORP

Package Description  

DIP, DIP8,.3

Common-mode Reject Ratio-Nom  

70 dB

Operating Temperature-Max  

85 °C

Operating Temperature-Min  

-40 °C

Package Body Material  

PLASTIC/EPOXY

Package Code  

DIP

Package Equivalence Code  

DIP8,.3

Package Shape  

RECTANGULAR

Package Style  

IN-LINE

Slew Rate-Nom  

0.7 V/us

Supply Voltage-Nom (Vsup)  

2.7 V

Type of heatsink  

extruded

Heatsink shape  

U

Colour  

aluminium

Material finishing  

raw

Plate thickness  

8mm

Gross weight  

1.05

Transport packaging size/quantity  

28.5*21*19/2000

Maximum current  

10 A

Noal voltage  

30 (AC/ DC) Vmin

Additional  

presence of a socket (F) Ф2 mm in the end of the plug

JESD-609 Code  

e0

ECCN Code  

EAR99

Type  

plug (M), Ф2 mm

Terminal Finish  

TIN LEAD

Color  

yellow

HTS Code  

8542.33.00.01

Terminal Position  

DUAL

Terminal Form  

THROUGH-HOLE

Number of Functions  

1

Terminal Pitch  

2.54 mm

Depth  

26.5 mm

Reach Compliance Code  

unknown

JESD-30 Code  

R-PDIP-T8

Qualification Status  

Not Qualified

Temperature Grade  

INDUSTRIAL

Supply Current-Max  

1.71 mA

Architecture  

VOLTAGE-FEEDBACK

Amplifier Type  

OPERATIONAL AMPLIFIER

Seated Height-Max  

5.08 mm

Unity Gain BW-Nom  

600

Average Bias Current-Max (IIB)  

0.000064 μA

Low-Offset  

NO

Frequency Compensation  

YES

Supply Voltage Limit-Max  

16 V

Low-Bias  

YES

Micropower  

NO

Programmable Power  

NO

Input Offset Voltage-Max  

6000 μV

Wideband  

NO

Power  

NO

Voltage Gain-Min  

6000

Common-mode Reject Ratio-Min  

65 dB

2nd Connector Number of Positions Loaded  

universal

Slew Rate-Min  

0.4 V/us

Length  

75mm

Width  

143mm

Height  

7