Contact Plating  

Tin

Surface Mount  

NO

Number of Terminals  

2

Transistor Element Material  

SILICON

Body Orientation  

Straight

Termination Method  

Solder

Base/Housing Material  

Nylon

Contact Materials  

Copper Alloy

Mounting  

Through Hole

Package  

Bulk

Base Product Number  

2N6674

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

N

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

175 °C

Rohs Code  

No

Transition Frequency-Nom (fT)  

15 MHz

Manufacturer Part Number  

2N6674

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.11

Part Package Code  

TO-3

Package Body Material  

METAL

Package Style  

FLANGE MOUNT

Operating Temperature  

-55 to 105 °C

Series  

*

Packaging  

Tray

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Gender  

HDR

Subcategory  

Transistors

Pitch  

4.2000 mm

Technology  

Si

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

Reference Standard  

MIL-19500/537

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Case Connection  

COLLECTOR

Polarity/Channel Type  

NPN

Product Type  

BJTs - Bipolar Transistors

JEDEC-95 Code  

TO-3

Power Dissipation-Max (Abs)  

175 W

Collector Current-Max (IC)  

15 A

DC Current Gain-Min (hFE)  

8

Collector-Emitter Voltage-Max  

300 V

Product Category  

Bipolar Transistors - BJT

Product Length  

21 mm