Factory Lead Time  

6 Weeks

Contact Plating  

Copper, Silver, Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

6-UFBGA, DSBGA

Number of Pins  

6

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

3A Ta

Drive Voltage (Max Rds On, Min Rds On)  

1.8V 4.5V

Number of Elements  

1

Power Dissipation (Max)  

750mW Ta

Turn Off Delay Time  

58 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

1.1V @ 250μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 5 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

6

ECCN Code  

EAR99

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Base Part Number  

CSD23203

Number of Channels  

1

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Turn On Delay Time  

14 ns

FET Type  

P-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

19.4m Ω @ 1.5A, 4.5V

Input Capacitance (Ciss) (Max) @ Vds  

914pF @ 4V

Gate Charge (Qg) (Max) @ Vgs  

6.3nC @ 4.5V

Rise Time  

12ns

Drain to Source Voltage (Vdss)  

8V

Fall Time (Typ)  

27 ns

Continuous Drain Current (ID)  

3A

Gate to Source Voltage (Vgs)  

-6V

Drain Current-Max (Abs) (ID)  

3A

Drain-source On Resistance-Max  

0.053Ohm

Drain to Source Breakdown Voltage  

-8V

Height  

1mm

Length  

1.5mm

Width  

1.8mm

Thickness  

2mm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free