Lifecycle Status  

ACTIVE (Last Updated: 2 days ago)

Factory Lead Time  

12 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-PowerTDFN

Number of Pins  

8

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

15A Ta 60A Tc

Drive Voltage (Max Rds On, Min Rds On)  

4.5V 10V

Number of Elements  

1

Power Dissipation (Max)  

2.6W Ta

Turn Off Delay Time  

6.3 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e3

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

5

Termination  

SMD/SMT

ECCN Code  

EAR99

Additional Feature  

AVALANCHE RATED

Terminal Position  

DUAL

Peak Reflow Temperature (Cel)  

260

Base Part Number  

CSD16409

Pin Count  

8

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2.6W

Case Connection  

DRAIN

Turn On Delay Time  

6.5 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

8.2m Ω @ 17A, 10V

Vgs(th) (Max) @ Id  

2.3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

800pF @ 12.5V

Gate Charge (Qg) (Max) @ Vgs  

5.6nC @ 4.5V

Rise Time  

10.6ns

Vgs (Max)  

+16V, -12V

Fall Time (Typ)  

3.4 ns

Continuous Drain Current (ID)  

60A

Threshold Voltage  

2V

Gate to Source Voltage (Vgs)  

16V

Drain to Source Breakdown Voltage  

25V

Pulsed Drain Current-Max (IDM)  

90A

Dual Supply Voltage  

25V

Avalanche Energy Rating (Eas)  

72 mJ

Nominal Vgs  

2 V

Feedback Cap-Max (Crss)  

55 pF

Height  

1.1mm

Length  

3.3mm

Width  

3.3mm

Thickness  

1mm

REACH SVHC  

No SVHC

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Contains Lead