Factory Lead Time  

8 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

6-VDFN Exposed Pad

Number of Pins  

6

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

22A Ta

Drive Voltage (Max Rds On, Min Rds On)  

2.5V 4.5V

Number of Elements  

1

Power Dissipation (Max)  

2.7W Ta

Turn Off Delay Time  

11 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

1.1V @ 250μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e4

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 2 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

6

ECCN Code  

EAR99

Terminal Finish  

Nickel/Palladium/Gold (Ni/Pd/Au)

Additional Feature  

AVALANCHE RATED

Terminal Position  

DUAL

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Base Part Number  

CSD13302

Number of Channels  

1

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2.7W

Case Connection  

DRAIN

Turn On Delay Time  

4.5 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

9.3m Ω @ 5A, 4.5V

Input Capacitance (Ciss) (Max) @ Vds  

997pF @ 6V

Gate Charge (Qg) (Max) @ Vgs  

6.6nC @ 4.5V

Rise Time  

28ns

Vgs (Max)  

±8V

Fall Time (Typ)  

13.6 ns

Continuous Drain Current (ID)  

22A

Threshold Voltage  

800mV

Gate to Source Voltage (Vgs)  

8V

Drain to Source Breakdown Voltage  

12V

Avalanche Energy Rating (Eas)  

20 mJ

Length  

2mm

Width  

2mm

Thickness  

750μm

REACH SVHC  

No SVHC

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free