Factory Lead Time  

6 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

4-UFBGA, DSBGA

Number of Pins  

4

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

2.2A Ta

Drive Voltage (Max Rds On, Min Rds On)  

1.5V 4.5V

Number of Elements  

1

Power Dissipation (Max)  

1W Ta

Turn Off Delay Time  

58 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

900mV @ 250μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 4 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

4

ECCN Code  

EAR99

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Base Part Number  

CSD23202

Number of Channels  

1

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

1W

Turn On Delay Time  

9 ns

FET Type  

P-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

53m Ω @ 500mA, 4.5V

Input Capacitance (Ciss) (Max) @ Vds  

512pF @ 6V

Gate Charge (Qg) (Max) @ Vgs  

3.8nC @ 4.5V

Rise Time  

4ns

Drain to Source Voltage (Vdss)  

12V

Vgs (Max)  

-6V

Fall Time (Typ)  

21 ns

Continuous Drain Current (ID)  

2.2A

Gate to Source Voltage (Vgs)  

6V

Drain to Source Breakdown Voltage  

-12V

Feedback Cap-Max (Crss)  

37 pF

Height  

625μm

Length  

0m

Width  

0m

Thickness  

650μm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free