Factory Lead Time  

6 Weeks

Contact Plating  

Copper, Silver, Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

4-UFBGA, DSBGA

Number of Pins  

4

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

1.6A Ta

Drive Voltage (Max Rds On, Min Rds On)  

2.5V 4.5V

Number of Elements  

1

Power Dissipation (Max)  

1.8W Ta

Turn Off Delay Time  

17 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

1.3V @ 250μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 2 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

4

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Additional Feature  

ULTRA LOW RESISTANCE

Terminal Position  

BOTTOM

Terminal Form  

BALL

Base Part Number  

CSD13302

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Turn On Delay Time  

6 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

17.1m Ω @ 1A, 4.5V

Input Capacitance (Ciss) (Max) @ Vds  

862pF @ 6V

Gate Charge (Qg) (Max) @ Vgs  

7.8nC @ 4.5V

Rise Time  

7ns

Drain to Source Voltage (Vdss)  

12V

Vgs (Max)  

±10V

Fall Time (Typ)  

7 ns

Continuous Drain Current (ID)  

1.6A

Gate to Source Voltage (Vgs)  

10V

Drain-source On Resistance-Max  

0.0285Ohm

Pulsed Drain Current-Max (IDM)  

29A

DS Breakdown Voltage-Min  

12V

Feedback Cap-Max (Crss)  

196 pF

Height  

625μm

Length  

0m

Width  

0m

Thickness  

650μm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free