Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-SOIC (0.154, 3.90mm Width)

Number of Pins  

8

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

4.1A 3A

Number of Elements  

2

Turn Off Delay Time  

81 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Published  

2006

JESD-609 Code  

e0

Part Status  

Obsolete

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

8

Terminal Finish  

Tin/Lead (Sn/Pb)

Voltage - Rated DC  

30V

Max Power Dissipation  

2W

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

240

Reach Compliance Code  

not_compliant

Current Rating  

4.1A

Time@Peak Reflow Temperature-Max (s)  

30

Base Part Number  

MMDF2C03HD

Pin Count  

8

Qualification Status  

Not Qualified

Configuration  

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2W

FET Type  

N and P-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

70m Ω @ 3A, 10V

Vgs(th) (Max) @ Id  

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

630pF @ 24V

Gate Charge (Qg) (Max) @ Vgs  

16nC @ 10V

Rise Time  

18ns

Polarity/Channel Type  

N-CHANNEL AND P-CHANNEL

Fall Time (Typ)  

194 ns

Continuous Drain Current (ID)  

3A

Gate to Source Voltage (Vgs)  

20V

Drain-source On Resistance-Max  

0.07Ohm

Drain to Source Breakdown Voltage  

30V

Pulsed Drain Current-Max (IDM)  

21A

Avalanche Energy Rating (Eas)  

324 mJ

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Logic Level Gate

RoHS Status  

Non-RoHS Compliant

Lead Free  

Contains Lead