Lifecycle Status  

ACTIVE (Last Updated: 4 days ago)

Factory Lead Time  

6 Weeks

Mounting Type  

Surface Mount

Package / Case  

8-PowerVDFN

Surface Mount  

YES

Number of Pins  

8

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

10A Ta

Number of Elements  

2

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e4

Pbfree Code  

yes

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

6

ECCN Code  

EAR99

Terminal Finish  

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Base Part Number  

CSD87503

Configuration  

COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE

Operating Mode  

ENHANCEMENT MODE

Case Connection  

DRAIN

Power - Max  

15.6W

FET Type  

2 N-Channel (Dual) Common Source

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

13.5m Ω @ 6A, 10V

Vgs(th) (Max) @ Id  

2.1V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

1020pF @ 15V

Gate Charge (Qg) (Max) @ Vgs  

17.4nC @ 4.5V

Drain to Source Voltage (Vdss)  

30V

Drain Current-Max (Abs) (ID)  

10A

DS Breakdown Voltage-Min  

30V

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Standard

Feedback Cap-Max (Crss)  

194 pF

Length  

3.3mm

Width  

3.3mm

Thickness  

1mm

RoHS Status  

ROHS3 Compliant