Factory Lead Time  

10 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

DO-214AB, SMC

Number of Pins  

2

Weight  

210.013267mg

Diode Element Material  

SILICON

Operating Temperature (Max)  

150°C

Operating Temperature (Min)  

-65°C

Number of Elements  

1

Packaging  

Tape & Reel (TR)

Published  

2009

JESD-609 Code  

e3

Pbfree Code  

no

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

2

ECCN Code  

EAR99

Applications  

GENERAL PURPOSE

HTS Code  

8541.10.00.80

Terminal Position  

DUAL

Terminal Form  

C BEND

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

S8MC

Element Configuration  

Single

Speed  

Standard Recovery >500ns, > 200mA (Io)

Diode Type  

Standard

Current - Reverse Leakage @ Vr  

10μA @ 1000V

Voltage - Forward (Vf) (Max) @ If  

985mV @ 8A

Forward Current  

8A

Operating Temperature - Junction  

-65°C~150°C

Max Surge Current  

200A

Output Current-Max  

8A

Voltage - DC Reverse (Vr) (Max)  

1000V

Forward Voltage  

985mV

Max Reverse Voltage (DC)  

1kV

Average Rectified Current  

8A

Number of Phases  

1

Peak Reverse Current  

10μA

Max Repetitive Reverse Voltage (Vrrm)  

1kV

Capacitance @ Vr, F  

40pF @ 4V 1MHz

Peak Non-Repetitive Surge Current  

200A

Max Forward Surge Current (Ifsm)  

200A

Reverse Voltage (DC)  

1kV

Height  

2.42mm

Length  

7.11mm

Width  

6.22mm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free