Mounting Type  

Surface Mount

Package / Case  

3-SMD, No Lead

Surface Mount  

YES

Supplier Device Package  

UB

Number of Terminals  

3

Transistor Element Material  

SILICON

Package  

Bulk

Mfr  

Microchip Technology

Product Status  

Discontinued at Digi-Key

Package Description  

SURFACE MOUNT PACKAGE-3

Package Style  

SMALL OUTLINE

Package Body Material  

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

200 °C

Rohs Code  

No

Manufacturer Part Number  

2N5114UB

Package Shape  

RECTANGULAR

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.1

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

Military, MIL-PRF-19500

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.21.00.95

Subcategory  

FET General Purpose Small Signal

Terminal Position  

DUAL

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

3

JESD-30 Code  

R-CDSO-N3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Operating Mode  

DEPLETION MODE

Power - Max  

500 mW

FET Type  

P-Channel

Input Capacitance (Ciss) (Max) @ Vds  

25pF @ 15V

Drain to Source Voltage (Vdss)  

30 V

Polarity/Channel Type  

P-CHANNEL

Drain-source On Resistance-Max  

75 Ω

DS Breakdown Voltage-Min  

30 V

FET Technology  

JUNCTION

Power Dissipation-Max (Abs)  

0.5 W

Feedback Cap-Max (Crss)  

7 pF

Current - Drain (Idss) @ Vds (Vgs=0)  

90 mA @ 18 V

Voltage - Cutoff (VGS off) @ Id  

10 V @ 1 nA

Voltage - Breakdown (V(BR)GSS)  

30 V

Resistance - RDS(On)  

75 Ohms