Factory Lead Time  

23 Weeks

Mounting Type  

Surface Mount

Package / Case  

100-TQFP

Surface Mount  

YES

Data Converters  

A/D 49x10b/12b

Number of I/Os  

85

ROM(word)  

262144

Usage Level  

Automotive grade

Operating Temperature  

-40°C~125°C TA

Packaging  

Tray

Series  

Automotive, AEC-Q100, dsPIC™ 33EP

Published  

2013

JESD-609 Code  

e3

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

100

Terminal Finish  

Matte Tin (Sn) - annealed

Terminal Position  

QUAD

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Supply Voltage  

3.3V

Terminal Pitch  

0.5mm

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

DSPIC33EP256GM310

JESD-30 Code  

S-PQFP-G100

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

3.6V

Power Supplies  

3.3V

Supply Voltage-Min (Vsup)  

3V

Oscillator Type  

Internal

Speed  

60 MIPs

RAM Size  

32K x 8

Voltage - Supply (Vcc/Vdd)  

3V~3.6V

uPs/uCs/Peripheral ICs Type  

MICROCONTROLLER

Core Processor  

dsPIC

Peripherals  

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Clock Frequency  

60MHz

Program Memory Type  

FLASH

Core Size  

16-Bit

Program Memory Size  

256KB 85.5K x 24

Connectivity  

I2C, IrDA, LINbus, QEI, SPI, UART/USART

Bit Size  

16

Has ADC  

YES

DMA Channels  

YES

PWM Channels  

YES

DAC Channels  

NO

On Chip Program ROM Width  

8

Screening Level  

TS 16949

Format  

FLOATING-POINT

RAM (words)  

16384

Length  

14mm

Height Seated (Max)  

1.2mm

Width  

14mm

RoHS Status  

ROHS3 Compliant