Mount  

Surface Mount

Package / Case  

423-LFBGA, FCBGA

Number of Pins  

423

Memory Types  

L2 Cache, ROM, SRAM

Operating Temperature  

0°C~90°C TJ

Packaging  

Tray

Series  

OMAP-35xx

JESD-609 Code  

e1

Pbfree Code  

no

Part Status  

Obsolete

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

423

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Supply Voltage  

1.8V

Terminal Pitch  

0.65mm

Frequency  

600MHz

Base Part Number  

OMAP3525

Pin Count  

423

Voltage  

1.35V

Interface  

I2C, MMC, SDIO, UART, USB

Max Supply Voltage  

1.35V

Min Supply Voltage  

985mV

RAM Size  

64kB

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM® Cortex®-A8

Bit Size  

32

Data Bus Width  

32b

Number of Timers/Counters  

12

Address Bus Width  

26

Core Architecture  

ARM

Boundary Scan  

YES

Low Power Mode  

YES

Format  

FLOATING POINT

Integrated Cache  

YES

Voltage - I/O  

1.8V 3.0V

Number of UART Channels  

3

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR

USB  

USB 1.x (3), USB 2.0 (1)

Additional Interfaces  

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Co-Processors/DSP  

Signal Processing; C64x+, Multimedia; NEON™ SIMD

Display & Interface Controllers  

LCD

Length  

16mm

Height Seated (Max)  

1.4mm

RoHS Status  

ROHS3 Compliant

Radiation Hardening  

No

Lead Free  

Contains Lead