Lifecycle Status  

ACTIVE (Last Updated: 4 days ago)

Factory Lead Time  

16 Weeks

Mount  

Surface Mount

Package / Case  

515-VFBGA, FCBGA

Number of Pins  

515

Memory Types  

L2 Cache, ROM, SRAM

Operating Temperature  

-40°C~105°C TJ

Packaging  

Tray

Series  

OMAP-35xx

JESD-609 Code  

e1

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

515

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Terminal Pitch  

0.5mm

Frequency  

600MHz

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Base Part Number  

OMAP3525

Pin Count  

515

Qualification Status  

Not Qualified

Operating Supply Voltage  

1.35V

Voltage  

1.35V

Interface  

I2C, SPI, UART, USB

Memory Size  

112kB

RAM Size  

64kB

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM® Cortex®-A8

Data Bus Width  

32b

Core Architecture  

ARM

Voltage - I/O  

1.8V 3.0V

Number of UART Channels  

3

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR

USB  

USB 1.x (3), USB 2.0 (1)

Additional Interfaces  

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Co-Processors/DSP  

Signal Processing; C64x+, Multimedia; NEON™ SIMD

Display & Interface Controllers  

LCD

Height  

950μm

Length  

14mm

Width  

14mm

Thickness  

630μm

RoHS Status  

Non-RoHS Compliant

Lead Free  

Lead Free