Lifecycle Status  

ACTIVE (Last Updated: 2 weeks ago)

Factory Lead Time  

6 Weeks

Mount  

Surface Mount

Package / Case  

423-LFBGA, FCBGA

Number of Pins  

423

Memory Types  

L2 Cache, ROM, SRAM

Operating Temperature  

0°C~90°C TJ

Packaging  

Tray

Series  

OMAP-35xx

JESD-609 Code  

e1

Part Status  

Active

Moisture Sensitivity Level (MSL)  

4 (72 Hours)

Number of Terminations  

423

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Terminal Pitch  

0.65mm

Frequency  

600MHz

Base Part Number  

OMAP3525

Pin Count  

423

Voltage  

1.35V

Interface  

I2C, SPI, UART, USB

Max Supply Voltage  

1.35V

Min Supply Voltage  

985mV

Memory Size  

112kB

RAM Size  

64kB

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM® Cortex®-A8

Data Bus Width  

32b

Core Architecture  

ARM

Voltage - I/O  

1.8V 3.0V

Number of UART Channels  

3

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR

USB  

USB 1.x (3), USB 2.0 (1)

Additional Interfaces  

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Co-Processors/DSP  

Signal Processing; C64x+, Multimedia; NEON™ SIMD

Display & Interface Controllers  

LCD

Height  

1.4mm

Length  

16mm

Width  

16mm

Thickness  

960μm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free