Factory Lead Time  

10 Weeks

Package / Case  

228-TFBGA

Surface Mount  

YES

Operating Temperature  

-40°C~105°C TA

Packaging  

Tray

Series  

SAM9X60

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

228

Terminal Position  

BOTTOM

Terminal Form  

BALL

Terminal Pitch  

0.65mm

JESD-30 Code  

R-PBGA-B228

Speed  

600MHz

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM926EJ-S

Clock Frequency  

48MHz

Address Bus Width  

26

Boundary Scan  

YES

Low Power Mode  

YES

External Data Bus Width  

32

Format  

FIXED POINT

Integrated Cache  

YES

Voltage - I/O  

3.3V

Ethernet  

10/100Mbps (2)

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR, LPSDR, DDR2, SDR, SRAM

USB  

USB 2.0 (3)

Voltage - Supply (Max)  

1.21V

Voltage - Supply (Min)  

1.12V

Security Features  

Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins

Display & Interface Controllers  

Keyboard, LCD, Touchscreen

Length  

11mm

Height Seated (Max)  

1.2mm

RoHS Status  

ROHS3 Compliant