Factory Lead Time  

10 Weeks

Package / Case  

228-TFBGA

Surface Mount  

YES

Operating Temperature  

-40°C~105°C TA

Packaging  

Tray

Series  

SAM9X60

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

228

Terminal Position  

BOTTOM

Terminal Form  

BALL

Terminal Pitch  

0.65mm

JESD-30 Code  

R-PBGA-B228

Supply Voltage-Max (Vsup)  

1.21V

Supply Voltage-Min (Vsup)  

1.12V

Speed  

600MHz

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

ARM926EJ-S

Clock Frequency  

48MHz

Address Bus Width  

26

Boundary Scan  

YES

Low Power Mode  

YES

External Data Bus Width  

32

Format  

FIXED POINT

Integrated Cache  

YES

Voltage - I/O  

3.3V

Ethernet  

10/100Mbps (2)

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

Yes

RAM Controllers  

LPDDR, LPSDR, DDR2, SDR, SRAM

USB  

USB 2.0 (3)

Security Features  

Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins

Display & Interface Controllers  

Keyboard, LCD, Touchscreen

Length  

11mm

Height Seated (Max)  

1.2mm

RoHS Status  

ROHS3 Compliant