Mounting Type  

Surface Mount

Package / Case  

Nonstandard SMD

Surface Mount  

YES

Supplier Device Package  

PLAD

Diode Element Material  

SILICON

Number of Terminals  

1

Package  

Bulk

Base Product Number  

PLAD30

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

PLASTIC PACKAGE-1

Package Style  

SMALL OUTLINE

Moisture Sensitivity Levels  

1

Package Body Material  

PLASTIC/EPOXY

Rohs Code  

No

Manufacturer Part Number  

MXPLAD30KP110CA

Power Dissipation (Max)  

2.5 W

Package Shape  

RECTANGULAR

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Breakdown Voltage-Nom  

128.5 V

Risk Rank  

5.47

Operating Temperature  

-55°C ~ 150°C (TJ)

Series  

Military, MIL-PRF-19500

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Type  

Zener

Terminal Finish  

Tin/Lead (Sn/Pb)

Applications  

General Purpose

Additional Feature  

HIGH RELIABILITY

HTS Code  

8541.10.00.50

Subcategory  

Transient Suppressors

Technology  

AVALANCHE

Terminal Position  

SINGLE

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

not_compliant

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

JESD-30 Code  

R-PSSO-G1

Qualification Status  

Not Qualified

Polarity  

BIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

TRANS VOLTAGE SUPPRESSOR DIODE

Case Connection  

CATHODE

Power Line Protection  

No

Voltage - Breakdown (Min)  

122V

Power - Peak Pulse  

30000W (30kW)

Current - Peak Pulse (10/1000μs)  

168A

Voltage - Clamping (Max) @ Ipp  

177V

Voltage - Reverse Standoff (Typ)  

110V

Bidirectional Channels  

1

Rep Pk Reverse Voltage-Max  

110 V

Capacitance @ Frequency  

-

Non-rep Peak Rev Power Dis-Max  

30000 W

Breakdown Voltage-Min  

122 V

Clamping Voltage-Max  

177 V

Breakdown Voltage-Max  

135 V