Mounting Type  

Surface Mount

Package / Case  

8-TSSOP (0.173, 4.40mm Width)

Surface Mount  

YES

Supplier Device Package  

8-TSSOP

Number of Terminals  

8

RoHS  

Non-Compliant

Package  

Bulk

Base Product Number  

CAT93C66

Mfr  

Catalyst Semiconductor Inc.

Product Status  

Active

Memory Types  

Non-Volatile

Package Description  

LEAD AND HALOGEN FREE, TSSOP-8

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels  

1

Number of Words Code  

256

Package Body Material  

PLASTIC/EPOXY

Reflow Temperature-Max (s)  

40

Operating Temperature-Max  

70 °C

Rohs Code  

Yes

Manufacturer Part Number  

CAT93C66Y

Clock Frequency-Max (fCLK)  

0.5 MHz

Number of Words  

256 words

Supply Voltage-Nom (Vsup)  

5 V

Package Code  

TSSOP

Package Shape  

RECTANGULAR

Manufacturer  

Rochester Electronics LLC

Part Life Cycle Code  

Active

Ihs Manufacturer  

ROCHESTER ELECTRONICS LLC

Risk Rank  

5.56

Part Package Code  

SOIC

Operating Temperature  

0°C ~ 70°C (TA)

Series  

-

JESD-609 Code  

e3

Pbfree Code  

Yes

Terminal Finish  

MATTE TIN

Additional Feature  

1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION

Technology  

EEPROM

Voltage - Supply  

1.8V ~ 5.5V

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

unknown

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

COMMERCIAL

Supply Voltage-Max (Vsup)  

6 V

Temperature Grade  

COMMERCIAL

Supply Voltage-Min (Vsup)  

2.5 V

Memory Size  

4Kbit

Operating Mode  

SYNCHRONOUS

Viewing Angle  

120 °

Clock Frequency  

2 MHz

Memory Format  

EEPROM

Memory Interface  

Microwire

Organization  

256X16

Seated Height-Max  

1.1 mm

Memory Width  

16

Write Cycle Time - Word, Page  

-

Memory Density  

4096 bit

Wavelength  

588 nm

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

MICROWIRE

Alternate Memory Width  

8

Memory Organization  

512 x 8, 256 x 16

Width  

3 mm

Length  

4.4 mm