Mount  

Surface Mount

Surface Mount  

YES

Number of Pins  

208

Number of Terminals  

208

RoHS  

Compliant

Package Description  

17 X 17 MM, 1.30 MM HEIGHT, MO-192, LBGA-208

Package Style  

GRID ARRAY, LOW PROFILE

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-40 °C

Supply Voltage-Nom  

1.8 V

Reflow Temperature-Max (s)  

30

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

MT93L00AV

Package Code  

LBGA

Package Shape  

SQUARE

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.77

Part Package Code  

BGA

JESD-609 Code  

e0

Pbfree Code  

No

Terminal Finish  

TIN LEAD

Max Operating Temperature  

85 °C

Min Operating Temperature  

-40 °C

HTS Code  

8542.39.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Number of Functions  

1

Terminal Pitch  

1 mm

Reach Compliance Code  

unknown

Pin Count  

208

JESD-30 Code  

S-PBGA-B208

Qualification Status  

Not Qualified

Temperature Grade  

INDUSTRIAL

Number of Circuits  

1

Operating Supply Current  

65 mA

Seated Height-Max  

1.5 mm

Telecom IC Type  

ISDN ECHO CANCELLER

Width  

17 mm

Length  

17 mm

Radiation Hardening  

No