Surface Mount  

YES

Material  

Aluminum

Shape  

Square, Fins

Package Cooled  

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish  

Blue Anodized

Number of Terminals  

3

Transistor Element Material  

SILICON

Package Description  

SMALL OUTLINE, R-PDSO-G3

Package Style  

SMALL OUTLINE

Package Body Material  

PLASTIC/EPOXY

Reflow Temperature-Max (s)  

40

Operating Temperature-Max  

150 °C

Rohs Code  

Yes

Transition Frequency-Nom (fT)  

100 MHz

Manufacturer Part Number  

BC807-16/T3

Package Shape  

RECTANGULAR

Manufacturer  

NXP Semiconductors

Number of Elements  

1

Part Life Cycle Code  

Transferred

Ihs Manufacturer  

NXP SEMICONDUCTORS

Risk Rank  

5.11

Part Package Code  

SOT-23

Series  

pushPIN™

JESD-609 Code  

e3

Part Status  

Active

ECCN Code  

EAR99

Type  

Top Mount

Terminal Finish  

TIN

HTS Code  

8541.21.00.95

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Pin Count  

3

JESD-30 Code  

R-PDSO-G3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Attachment Method  

Push Pin

Height Off Base (Height of Fin)  

0.790 (20.00mm)

Thermal Resistance @ Forced Air Flow  

9.37°C/W @ 100 LFM

Transistor Application  

SWITCHING

Polarity/Channel Type  

PNP

JEDEC-95 Code  

TO-236AB

Collector Current-Max (IC)  

0.5 A

DC Current Gain-Min (hFE)  

100

Collector-Emitter Voltage-Max  

45 V

VCEsat-Max  

0.7 V

Thermal Resistance @ Natural  

--

Power Dissipation @ Temperature Rise  

--

Diameter  

--

Length  

0.984 (25.00mm)

Width  

0.984 (25.00mm)

REACH SVHC  

unknown