Package / Case  

Axial

Surface Mount  

NO

Supplier Device Package  

Axial

Number of Terminals  

16

Package Description  

DIP, DIP16,.3

Package Style  

IN-LINE

Package Body Material  

CERAMIC

Package Equivalence Code  

DIP16,.3

Operating Temperature-Min  

-30 °C

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

10159F

Package Code  

DIP

Package Shape  

RECTANGULAR

Manufacturer  

Philips Semiconductors

Part Life Cycle Code  

Transferred

Ihs Manufacturer  

PHILIPS SEMICONDUCTORS

Risk Rank  

5.85

Prop.  

5.3 ns

Operating Temperature  

-55°C ~ 175°C

Series  

CMF

Packaging  

Tape & Reel (TR)

Size / Dimension  

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

Tolerance  

±0.1%

JESD-609 Code  

e0

Part Status  

Active

Number of Terminations  

2

Temperature Coefficient  

±25ppm/°C

Resistance  

150 kOhms

Terminal Finish  

Tin/Lead (Sn/Pb)

Composition  

Metal Film

Power (Watts)  

0.5W, 1/2W

Subcategory  

Multiplexer/Demultiplexers

Technology  

ECL10K

Terminal Position  

DUAL

Terminal Form  

THROUGH-HOLE

Number of Functions  

4

Terminal Pitch  

2.54 mm

Reach Compliance Code  

unknown

JESD-30 Code  

R-XDIP-T16

Qualification Status  

Not Qualified

Failure Rate  

--

Power Supplies  

-5.2 V

Temperature Grade  

OTHER

Number of Inputs  

2

Logic IC Type  

MULTIPLEXER

Power Supply Current-Max (ICC)  

58 mA

Features  

Flame Retardant Coating, Moisture Resistant, Safety

Height Seated (Max)  

--