Mounting Type  

Through Hole

Surface Mount  

YES

Material - Insulation  

Diallyl Phthalate (DAP)

Contact Materials  

Copper Alloy

Product Status  

Active

Mfr  

EDAC Inc.

Base Product Number  

336-058

Package  

Bulk

Operating Temperature-Max  

150 °C

Rohs Code  

No

Manufacturer Part Number  

BUD43D2

Manufacturer  

ON Semiconductor

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

ON SEMICONDUCTOR

Risk Rank  

5.87

Series  

336

Operating Temperature  

-65°C ~ 125°C

JESD-609 Code  

e0

Termination  

Wire Wrap

Number of Positions  

58

Terminal Finish  

Tin/Lead (Sn/Pb)

Color  

Green

Number of Rows  

2

Gender  

Female

Subcategory  

Other Transistors

Contact Type  

Cantilever

Pitch  

0.156 (3.96mm)

Contact Finish  

Gold

Card Type  

Non Specified - Dual Edge

Read Out  

Dual

Configuration  

Single

Number of Positions/Bay/Row  

29

Flange Feature  

Top Mount Opening, Unthreaded, 0.178 (4.52mm) Dia

Polarity/Channel Type  

NPN

Power Dissipation-Max (Abs)  

25 W

Collector Current-Max (IC)  

2 A

DC Current Gain-Min (hFE)  

7

Features  

-

Contact Finish Thickness  

10.0µin (0.25µm)

Card Thickness  

0.054 ~ 0.070 (1.37mm ~ 1.78mm)

REACH SVHC  

not_compliant