Surface Mount  

NO

Material  

Aluminum

Shape  

Square, Fins

Package Cooled  

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish  

Blue Anodized

Number of Terminals  

3

Package Description  

FLANGE MOUNT, R-PSFM-T3

Package Style  

FLANGE MOUNT

Leakage Current-Max  

0.5 mA

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-40 °C

Operating Temperature-Max  

125 °C

Rohs Code  

No

Manufacturer Part Number  

BT138F-600

Package Shape  

RECTANGULAR

Manufacturer  

NXP Semiconductors

Number of Elements  

1

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

NXP SEMICONDUCTORS

Risk Rank  

5.2

Part Package Code  

SFM

Series  

pushPIN™

Part Status  

Active

Type  

Top Mount

HTS Code  

8541.30.00.80

Subcategory  

TRIACs

Terminal Position  

SINGLE

Terminal Form  

THROUGH-HOLE

Pin Count  

3

JESD-30 Code  

R-PSFM-T3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Attachment Method  

Push Pin

Height Off Base (Height of Fin)  

0.590 (15.00mm)

Thermal Resistance @ Forced Air Flow  

15.39°C/W @ 100 LFM

Case Connection  

ISOLATED

Trigger Device Type  

4 QUADRANT LOGIC LEVEL TRIAC

Repetitive Peak Off-state Voltage  

600 V

Critical Rate of Rise of Off-State Voltage-Min  

100 V/us

RMS On-state Current-Max  

12 A

Holding Current-Max  

30 mA

Thermal Resistance @ Natural  

--

DC Gate Trigger Current-Max  

35 mA

DC Gate Trigger Voltage-Max  

1.5 V

Power Dissipation @ Temperature Rise  

--

Repetitive Peak Off-state Leakage Current-Max  

500 µA

Width  

1.772 (45.00mm)

Length  

1.772 (45.00mm)

Diameter  

--

REACH SVHC  

unknown