Surface Mount  

YES

Number of Pins  

56

Number of Terminals  

56

RoHS  

Non-Compliant

Package Description  

0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56

Package Style  

SMALL OUTLINE, SHRINK PITCH

Number of Words Code  

2000000

Package Body Material  

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min  

-40 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Access Time-Max  

90 ns

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

WF2M16-90DAI5

Number of Words  

2097152 words

Supply Voltage-Nom (Vsup)  

5 V

Package Code  

SSOP

Package Shape  

RECTANGULAR

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Transferred

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.41

Part Package Code  

SSOP

Packaging  

Bulk

JESD-609 Code  

e4

Pbfree Code  

No

ECCN Code  

3A991.B.1.A

Type  

NOR TYPE

Terminal Finish  

GOLD

Max Operating Temperature  

85 °C

Min Operating Temperature  

-40 °C

HTS Code  

8542.32.00.51

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Number of Functions  

1

Reach Compliance Code  

unknown

Pin Count  

56

JESD-30 Code  

R-CDSO-G56

Qualification Status  

Not Qualified

Operating Supply Voltage  

5 V

Supply Voltage-Max (Vsup)  

5.5 V

Temperature Grade  

INDUSTRIAL

Supply Voltage-Min (Vsup)  

4.5 V

Operating Mode  

ASYNCHRONOUS

Data Bus Width  

16 b

Organization  

2MX16

Memory Width  

16

Memory Density  

33554432 bit

Parallel/Serial  

PARALLEL

Memory IC Type  

FLASH MODULE

Programming Voltage  

5 V

Alternate Memory Width  

8

Width  

12.96 mm

Radiation Hardening  

No