Mounting Type  

Surface Mount

Package / Case  

3-SMD, No Lead

Surface Mount  

YES

Supplier Device Package  

3-UB (3.09x2.45)

Number of Terminals  

3

Transistor Element Material  

SILICON

Package  

Bulk

Base Product Number  

2N4093

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

SMALL OUTLINE, R-CDSO-N3

Package Style  

SMALL OUTLINE

Package Body Material  

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

2N4093UB

Package Shape  

RECTANGULAR

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.13

Mounting Styles  

Through Hole

Operating Temperature  

-65°C ~ 175°C (TJ)

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.21.00.95

Technology  

Si

Terminal Position  

DUAL

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

3

JESD-30 Code  

R-CDSO-N3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Operating Mode  

DEPLETION MODE

Power - Max  

360 mW

FET Type  

N-Channel

Input Capacitance (Ciss) (Max) @ Vds  

16pF @ 20V

Drain to Source Voltage (Vdss)  

40 V

Polarity/Channel Type  

N-CHANNEL

Drain-source On Resistance-Max  

80 Ω

DS Breakdown Voltage-Min  

40 V

FET Technology  

JUNCTION

Feedback Cap-Max (Crss)  

5 pF

Current - Drain (Idss) @ Vds (Vgs=0)  

8 mA @ 20 V

Voltage - Breakdown (V(BR)GSS)  

40 V

Resistance - RDS(On)  

80 Ohms