Lifecycle Status  

Production (Last Updated: 2 days ago)

Package / Case  

QFN

Contact Plating  

Gold

Mount  

Surface Mount

Product Depth (mm)  

3.2(mm)

Operating Temp Range  

-20C to 70C

Mounting Styles  

Surface Mount

Body Orientation  

Straight

Termination Method  

Solder

Contact Materials  

Beryllium Copper

Mounting  

Surface Mount

Number of Contact Rows  

1

Row Spacing (mm)  

Not Required(mm)

Grid Size  

Not Required

Rad Hardened  

No

Pitch (mm)  

Not Required(mm)

Circuit Applications  

Power

Inside Diameter  

1.25 mm

RoHS  

Compliant

Maximum Operating Temperature  

+ 125 C

Minimum Operating Temperature  

- 65 C

Factory Pack QuantityFactory Pack Quantity  

2000

Manufacturer  

TE Connectivity

Brand  

TE Connectivity / AMP

Usage Level  

Commercial grade

Packaging  

Bulk

Termination  

Press-Fit

Connector Type  

Socket

Type  

Discrete Socket

Number of Positions  

1

Max Operating Temperature  

257 °C

Min Operating Temperature  

-85 °C

Number of Rows  

1

Gender  

Receptacle

Subcategory  

IC & Component Sockets

Pitch  

-

Orientation  

Straight

Depth  

2.99 mm

Current Rating  

7.5/Contact(A)

Pin Count  

6

Termination Style  

Solder

Number of Contacts  

1(POS)

Row Spacing  

-

ELV  

Compliant

Max Current Rating  

7.5 A

Wire/Cable Type  

Discrete

Sealable  

No

Contact Current Rating  

7.5 A

Product Type  

IC & Component Sockets

Hole Diameter  

2.667 mm

Screening Level  

COMMERCIALC

Flange Diameter  

2.9972 mm

Socket Depth  

6.985 mm

Product  

Socket Pins

Product Category  

IC & Component Sockets

Product Length  

7.82 mm

Product Length (mm)  

5(mm)

Length  

7.8232 mm

Plating Thickness  

30 µm

PCB Thickness  

3.18 mm

Board Thickness  

3.175 mm

Product Height (mm)  

0.75(mm)

Radiation Hardening  

No

Lead Free  

Lead Free