Mounting Type  

Chassis Mount

Package / Case  

SP1

Surface Mount  

NO

Supplier Device Package  

SP1

Diode Element Material  

SILICON

Number of Terminals  

12

Package  

Bulk

Base Product Number  

APTDF30

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

Details

Package Description  

R-XUFM-T12

Package Style  

FLANGE MOUNT

Moisture Sensitivity Levels  

1

Package Body Material  

UNSPECIFIED

Operating Temperature-Min  

-40 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

175 °C

Rohs Code  

Yes

Manufacturer Part Number  

APTDF30H1201G

Package Shape  

RECTANGULAR

Number of Elements  

4

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Forward Voltage-Max (VF)  

3.1 V

Risk Rank  

5.75

Operating Temperature  

-40°C ~ 175°C (TJ)

Series  

-

Packaging  

Tube

JESD-609 Code  

e1

Pbfree Code  

Yes

Terminal Finish  

TIN SILVER COPPER

HTS Code  

8541.10.00.80

Subcategory  

Discrete Semiconductor Modules

Technology  

Standard

Terminal Position  

UPPER

Terminal Form  

THROUGH-HOLE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

12

JESD-30 Code  

R-XUFM-T12

Qualification Status  

Not Qualified

Configuration  

BRIDGE, 4 ELEMENTS

Diode Type  

Single Phase

Current - Reverse Leakage @ Vr  

100 µA @ 1200 V

Voltage - Forward (Vf) (Max) @ If  

3.1 V @ 30 A

Case Connection  

ISOLATED

Output Current-Max  

43 A

Current - Average Rectified (Io)  

43 A

Product Type  

Discrete Semiconductor Modules

Number of Phases  

1

Rep Pk Reverse Voltage-Max  

1200 V

Non-rep Pk Forward Current-Max  

210 A

Voltage - Peak Reverse (Max)  

1.2 kV

Breakdown Voltage-Min  

1200 V

Repetitive Peak Reverse Voltage  

1.2

Product Category  

Discrete Semiconductor Modules