Mounting Type  

Through Hole

Package / Case  

TO-206AA, TO-18-3 Metal Can

Surface Mount  

NO

Supplier Device Package  

TO-18

Number of Terminals  

3

Package  

Bulk

Base Product Number  

2N5116

Mfr  

Microchip Technology

Product Status  

Active

Mounting Styles  

Through Hole

Package Description  

CYLINDRICAL, O-MBCY-W3

Package Style  

CYLINDRICAL

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

MX2N5116

Package Shape  

ROUND

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.76

Part Package Code  

BCY

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

Military, MIL-PRF-19500

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Technology  

Si

Terminal Position  

BOTTOM

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

3

JESD-30 Code  

O-MBCY-W3

Qualification Status  

Not Qualified

Power - Max  

500 mW

FET Type  

P-Channel

Input Capacitance (Ciss) (Max) @ Vds  

27pF @ 15V

Drain to Source Voltage (Vdss)  

30 V

JEDEC-95 Code  

TO-18

Channel Type  

P

Current - Drain (Idss) @ Vds (Vgs=0)  

25 mA @ 15 V

Voltage - Cutoff (VGS off) @ Id  

4 V @ 1 nA

Voltage - Breakdown (V(BR)GSS)  

30 V

Resistance - RDS(On)  

175 Ohms