Mounting Type  

Surface Mount

Package / Case  

Nonstandard SMD

Surface Mount  

YES

Number of Pins  

1

Supplier Device Package  

PLAD

Diode Element Material  

SILICON

Number of Terminals  

1

Package  

Bulk

Base Product Number  

PLAD30

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

S-PSSO-G1

Package Style  

SMALL OUTLINE

Moisture Sensitivity Levels  

1

Package Body Material  

PLASTIC/EPOXY

Rohs Code  

No

Manufacturer Part Number  

MXPLAD30KP180CA

Power Dissipation (Max)  

2.5 W

Package Shape  

SQUARE

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.47

Operating Temperature  

-55°C ~ 150°C (TJ)

Series  

Military, MIL-PRF-19500

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Type  

Zener

Terminal Finish  

Tin/Lead (Sn/Pb)

Applications  

General Purpose

HTS Code  

8541.10.00.50

Technology  

AVALANCHE

Terminal Position  

SINGLE

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

not_compliant

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

JESD-30 Code  

S-PSSO-G1

Qualification Status  

Not Qualified

Polarity  

BIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

TRANS VOLTAGE SUPPRESSOR DIODE

Power Line Protection  

No

Voltage - Breakdown (Min)  

200V

Power - Peak Pulse  

30000W (30kW)

Current - Peak Pulse (10/1000μs)  

104A

Voltage - Clamping (Max) @ Ipp  

291V

Voltage - Reverse Standoff (Typ)  

180V

Bidirectional Channels  

1

Rep Pk Reverse Voltage-Max  

180 V

Capacitance @ Frequency  

-

Non-rep Peak Rev Power Dis-Max  

30000 W

Breakdown Voltage-Min  

200 V

Breakdown Voltage-Max  

221 V