Contact Plating  

Lead, Tin

Mount  

Through Hole

Surface Mount  

NO

Number of Terminals  

2

Transistor Element Material  

SILICON

Transistor Polarity  

NPN

Package  

Bulk

Base Product Number  

2N6673

Mfr  

Microchip Technology

Product Status  

Active

Number of Elements  

1

RoHS  

Compliant

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

Package Description  

FLANGE MOUNT, O-MBFM-P2

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

175 °C

Rohs Code  

No

Transition Frequency-Nom (fT)  

15 MHz

Manufacturer Part Number  

2N6673

Package Shape  

ROUND

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.15

Series  

*

Packaging  

Bulk

JESD-609 Code  

e0

Pbfree Code  

No

Terminal Finish  

TIN LEAD

HTS Code  

8541.29.00.95

Subcategory  

Transistors

Max Power Dissipation  

150 W

Technology  

Si

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

2

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Polarity  

NPN

Configuration  

Single

Power Dissipation  

150 W

Polarity/Channel Type  

NPN

Product Type  

BJTs - Bipolar Transistors

Collector Emitter Voltage (VCEO)  

400 V

Max Collector Current  

8 A

JEDEC-95 Code  

TO-3

Power Dissipation-Max (Abs)  

150 W

Collector Current-Max (IC)  

8 A

DC Current Gain-Min (hFE)  

10

Continuous Collector Current  

8

Collector-Emitter Voltage-Max  

400 V

Product Category  

Bipolar Transistors - BJT