Mounting Type  

Board Edge, Through Hole, Right Angle

Package / Case  

TO-213AA, TO-66-2

Surface Mount  

NO

Number of Pins  

2

Supplier Device Package  

TO-66 (TO-213AA)

Number of Terminals  

2

Transistor Element Material  

SILICON

Lead Free Status / RoHS Status  

--

Voltage, Rating  

500Vrms

Package  

Bulk

Current-Collector (Ic) (Max)  

1 A

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

METAL CAN-3

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

2N3738

Package Shape  

ROUND

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.14

Part Package Code  

TO-66

Operating Temperature  

-55°C ~ 125°C

Series  

Z-PACK

Packaging  

Tray

JESD-609 Code  

e0

Pbfree Code  

No

Part Status  

Active

Moisture Sensitivity Level (MSL)  

--

Termination  

Press-Fit

ECCN Code  

EAR99

Connector Type  

Header, Male Pins

Number of Positions  

55

Terminal Finish  

TIN LEAD

Number of Rows  

5

HTS Code  

8541.29.00.95

Pitch  

0.079 (2.00mm)

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Number of Positions Loaded  

All

Reach Compliance Code  

unknown

Current Rating  

1.5A

Contact Finish  

Gold

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Connector Style  

C 11

Power - Max  

20 W

Polarity/Channel Type  

NPN

Transistor Type  

PNP

DC Current Gain (hFE) (Min) @ Ic, Vce  

-

Current - Collector Cutoff (Max)  

-

JEDEC-95 Code  

TO-66

Vce Saturation (Max) @ Ib, Ic  

-

Voltage - Collector Emitter Breakdown (Max)  

225 V

Frequency - Transition  

-

Connector Usage  

Backplane

Collector Current-Max (IC)  

1 A

DC Current Gain-Min (hFE)  

40

Collector-Emitter Voltage-Max  

225 V

Features  

--

Contact Finish Thickness  

30.0µin (0.76µm)