Mounting Type  

Chassis, Stud Mount

Package / Case  

DO-203AA, DO-4, Stud

Surface Mount  

NO

Supplier Device Package  

DO-213AA

Material  

Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)

Shape  

Square

Diode Element Material  

SILICON

Number of Terminals  

1

Package  

Bulk

Base Product Number  

1N2986

Impedance (Max) (Zzt)  

5 Ohms

Mfr  

Microchip Technology

Product Status  

Discontinued at Digi-Key

Package Description  

HERMETIC SEALED, GLASS, DO-4, 1 PIN

Package Style  

POST/STUD MOUNT

Package Body Material  

METAL

Operating Temperature-Min  

-65 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

24 V

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

1N2986B

Power Dissipation (Max)  

10 W

Package Shape  

ROUND

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.21

Part Package Code  

DO-4

Operating Temperature  

--

Series  

--

Tolerance  

±5%

JESD-609 Code  

e0

Pbfree Code  

No

Part Status  

Active

ECCN Code  

EAR99

Type  

Fabric Over Foam

Terminal Finish  

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

HTS Code  

8541.10.00.50

Technology  

ZENER

Terminal Position  

UPPER

Terminal Form  

SOLDER LUG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

1

JESD-30 Code  

O-MUPM-D1

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Plating  

--

Attachment Method  

Adhesive

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

10 µA @ 18.2 V

Voltage - Forward (Vf) (Max) @ If  

1.5 V @ 2 A

Case Connection  

ANODE

Power - Max  

10 W

Voltage - Zener (Nom) (Vz)  

24 V

Voltage Tol-Max  

5%

JEDEC-95 Code  

DO-203AA

Working Test Current  

105 mA

Width  

0.374 (9.50mm)

Height  

0.374 (9.50mm)

Length  

12.750 (323.85mm)

Plating Thickness  

--