Package / Case  

MELF

Surface Mount  

YES

Diode Element Material  

SILICON

Number of Terminals  

2

Vr - Reverse Voltage  

500 V

Ir - Reverse Current  

10 uA

Maximum Diode Capacitance  

4 pF

Pd - Power Dissipation  

13 W

Maximum Operating Temperature  

+ 150 C

Minimum Operating Temperature  

- 55 C

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

SMD/SMT

Maximum Series Resistance @ Maximum IF  

200 mOhms

Manufacturer  

Microchip

Brand  

Microchip Technology

Carrier Life  

30 us

If - Forward Current  

500 mA

RoHS  

N

Package Description  

HERMETIC SEALED, MELF-2

Package Style  

LONG FORM

Package Body Material  

GLASS

Manufacturer Package Code  

CASE SM

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

150 °C

Rohs Code  

No

Manufacturer Part Number  

HUM2005SM

Power Dissipation (Max)  

13 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.17

Part Package Code  

MELF

JESD-609 Code  

e0

ECCN Code  

EAR99

Type  

High Power Pin Diodes

Terminal Finish  

TIN LEAD

Applications  

SWITCHING

Additional Feature  

HIGH RELIABILITY

HTS Code  

8541.10.00.80

Subcategory  

Diodes & Rectifiers

Technology  

Si

Terminal Position  

END

Terminal Form  

WRAP AROUND

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

JESD-30 Code  

O-LELF-R2

Qualification Status  

Not Qualified

Configuration  

Single

Diode Type  

PIN DIODE

Case Connection  

ISOLATED

Product Type  

PIN Diodes

Breakdown Voltage-Min  

500 V

Reverse Test Voltage  

100 V

Diode Capacitance-Nom  

3.4 pF

Diode Capacitance-Max  

4 pF

Minority Carrier Lifetime-Nom  

30 µs

Diode Res Test Current  

500 mA

Diode Res Test Frequency  

4 MHz

Diode Forward Resistance-Max  

0.2 Ω

Vf - Forward Voltage  

0.85 V

Product Category  

PIN Diodes