Surface Mount  

NO

Material  

Aluminum

Shape  

Square, Fins

Package Cooled  

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish  

Blue Anodized

Number of Terminals  

32

Supply Voltage-Nom (Vsup)  

5 V

Package Code  

DIP

Package Shape  

RECTANGULAR

Manufacturer  

Rochester Electronics LLC

Part Life Cycle Code  

Active

Ihs Manufacturer  

ROCHESTER ELECTRONICS LLC

Risk Rank  

5.56

Package Description  

DIP,

Package Style  

IN-LINE

Number of Words Code  

128000

Package Body Material  

PLASTIC/EPOXY

Access Time-Max  

55 ns

Operating Temperature-Max  

70 °C

Manufacturer Part Number  

AM27C010-55PC

Number of Words  

131072 words

Series  

pushPIN™

Part Status  

Active

Type  

Top Mount

HTS Code  

8542.32.00.71

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

THROUGH-HOLE

Number of Functions  

1

Terminal Pitch  

2.54 mm

Reach Compliance Code  

unknown

JESD-30 Code  

R-PDIP-T32

Temperature Grade  

COMMERCIAL

Attachment Method  

Push Pin

Height Off Base (Height of Fin)  

0.394 (10.00mm)

Thermal Resistance @ Forced Air Flow  

28.85°C/W @ 100 LFM

Operating Mode  

ASYNCHRONOUS

Organization  

128KX8

Seated Height-Max  

5.715 mm

Memory Width  

8

Memory Density  

1048576 bit

Parallel/Serial  

PARALLEL

Memory IC Type  

OTP ROM

Voltage - Supply (Max)  

5.5 V

Voltage - Supply (Min)  

4.5 V

Thermal Resistance @ Natural  

--

Power Dissipation @ Temperature Rise  

--

Width  

0.984 (25.00mm)

Length  

0.984 (25.00mm)

Diameter  

--