Package / Case  

484-BGA

Surface Mount  

YES

Supplier Device Package  

484-FPBGA (23x23)

Number of Terminals  

484

Number of I/Os  

MCU - 41, FPGA - 94

Package  

Tray

Base Product Number  

A2F200

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

BGA, BGA484,26X26,40

Package Style  

GRID ARRAY

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA484,26X26,40

Operating Temperature-Min  

-40 °C

Supply Voltage-Nom  

1.5 V

Reflow Temperature-Max (s)  

20

Supply Voltage-Min  

1.425 V

Operating Temperature-Max  

100 °C

Rohs Code  

No

Manufacturer Part Number  

A2F200M3F-FG484I

Clock Frequency-Max  

80 MHz

Package Code  

BGA

Package Shape  

SQUARE

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.575 V

Risk Rank  

5.23

Operating Temperature  

-40°C ~ 100°C (TJ)

Series  

SmartFusion®

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Subcategory  

Field Programmable Gate Arrays

Technology  

CMOS

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B484

Number of Outputs  

94

Qualification Status  

Not Qualified

Power Supplies  

1.5,1.8,2.5,3.3 V

Temperature Grade  

INDUSTRIAL

Speed  

80MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

DMA, POR, WDT

Connectivity  

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Architecture  

MCU, FPGA

Number of Inputs  

94

Organization  

4608 CLBS, 200000 GATES

Seated Height-Max  

2.44 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes  

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Number of CLBs  

4608

Number of Logic Cells  

4608

Number of Equivalent Gates  

200000

Flash Size  

256KB

Width  

23 mm

Length  

23 mm