Surface Mount  

NO

Diode Element Material  

SILICON

Number of Terminals  

3

Vr - Reverse Voltage  

1600 V

Maximum Operating Temperature  

+ 150 C

Minimum Operating Temperature  

- 40 C

Factory Pack QuantityFactory Pack Quantity  

10

Mounting Styles  

Screw Mounts

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

Details

Package Description  

R-XUFM-X3

Package Style  

FLANGE MOUNT

Package Body Material  

UNSPECIFIED

Manufacturer Package Code  

CASE D1

Operating Temperature-Min  

-40 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

150 °C

Manufacturer Part Number  

MSCD60-16

Package Shape  

RECTANGULAR

Number of Elements  

2

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.82

JESD-609 Code  

e0

ECCN Code  

EAR99

Type  

Rectifier Diode Module

Terminal Finish  

TIN LEAD

Applications  

GENERAL PURPOSE

Additional Feature  

UL RECOGNIZED

HTS Code  

8541.10.00.80

Subcategory  

Discrete Semiconductor Modules

Technology  

Si

Terminal Position  

UPPER

Terminal Form  

UNSPECIFIED

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

3

JESD-30 Code  

R-XUFM-X3

Qualification Status  

Not Qualified

Configuration  

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Type  

RECTIFIER DIODE

Case Connection  

ISOLATED

Output Current-Max  

60 A

Product Type  

Discrete Semiconductor Modules

Number of Phases  

1

Rep Pk Reverse Voltage-Max  

1600 V

Non-rep Pk Forward Current-Max  

1150 A

Product  

Diode Power Modules

Vf - Forward Voltage  

1.3 V

Product Category  

Discrete Semiconductor Modules