Package / Case  

144-LQFP

Surface Mount  

YES

Supplier Device Package  

144-TQFP (20x20)

Number of Terminals  

144

Number of I/Os  

84

Package  

Tray

Mfr  

Microchip Technology

Product Status  

Obsolete

Package Description  

TQFP-144

Package Style  

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

QFP144,.87SQ,20

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

30

Supply Voltage-Min  

1.14 V

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

M2S005-TQ144

Package Code  

LFQFP

Package Shape  

SQUARE

Manufacturer  

Microsemi Corporation

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.26 V

Risk Rank  

5.85

Operating Temperature  

0°C ~ 85°C (TJ)

Series  

SmartFusion®2

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Subcategory  

Field Programmable Gate Arrays

Technology  

CMOS

Terminal Position  

QUAD

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

240

Terminal Pitch  

0.5 mm

Reach Compliance Code  

not_compliant

JESD-30 Code  

S-PQFP-G144

Number of Outputs  

84

Qualification Status  

Not Qualified

Power Supplies  

1.2 V

Temperature Grade  

OTHER

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

-

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Number of Inputs  

84

Seated Height-Max  

1.6 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes  

FPGA - 5K Logic Modules

Number of Logic Cells  

6060

Flash Size  

128KB

Width  

20 mm

Length  

20 mm