Mounting Type  

Stud Mount

Package / Case  

TO-210AA, TO-59-4, Stud

Surface Mount  

NO

Supplier Device Package  

TO-59

Number of Terminals  

3

Transistor Element Material  

SILICON

Package  

Bulk

Current-Collector (Ic) (Max)  

50 µA

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

POST/STUD MOUNT, O-MUPM-X3

Package Style  

POST/STUD MOUNT

Package Body Material  

METAL

Operating Temperature-Max  

200 °C

Rohs Code  

No

Manufacturer Part Number  

JANSM2N5004

Package Shape  

ROUND

Manufacturer  

Microsemi Corporation

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.84

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

Military, MIL-PRF-19500/534

Terminal Position  

UPPER

Terminal Form  

UNSPECIFIED

Reach Compliance Code  

compliant

Reference Standard  

MIL-19500; RH - 3K Rad(Si)

JESD-30 Code  

O-MUPM-X3

Configuration  

SINGLE

Case Connection  

ISOLATED

Power - Max  

2 W

Transistor Application  

SWITCHING

Polarity/Channel Type  

NPN

Transistor Type  

NPN

DC Current Gain (hFE) (Min) @ Ic, Vce  

70 @ 2.5A, 5V

Current - Collector Cutoff (Max)  

50µA

JEDEC-95 Code  

TO-59

Vce Saturation (Max) @ Ib, Ic  

1.5V @ 500mA, 5A

Voltage - Collector Emitter Breakdown (Max)  

80 V

Frequency - Transition  

-

Collector Current-Max (IC)  

5 A

DC Current Gain-Min (hFE)  

70

Collector-Emitter Voltage-Max  

80 V