Mounting Type  

Chassis Mount

Package / Case  

4-Square, MB

Surface Mount  

NO

Supplier Device Package  

MB

Diode Element Material  

SILICON

Number of Terminals  

4

Package  

Bulk

Base Product Number  

803-1

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

N

Package Description  

S-PUFM-X4

Package Style  

FLANGE MOUNT

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-65 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

150 °C

Rohs Code  

No

Manufacturer Part Number  

803-1

Package Shape  

SQUARE

Number of Elements  

4

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.38

Operating Temperature  

-65°C ~ 150°C (TJ)

Series  

MIL-PRF-19500

Packaging  

Tray

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.10.00.80

Subcategory  

Diodes & Rectifiers

Technology  

Standard

Terminal Position  

UPPER

Terminal Form  

UNSPECIFIED

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

JESD-30 Code  

S-PUFM-X4

Qualification Status  

Not Qualified

Configuration  

BRIDGE, 4 ELEMENTS

Diode Type  

Single Phase

Current - Reverse Leakage @ Vr  

10 µA @ 50 V

Voltage - Forward (Vf) (Max) @ If  

950 mV @ 6 A

Case Connection  

ISOLATED

Output Current-Max  

22.5 A

Current - Average Rectified (Io)  

22.5 A

Product Type  

Bridge Rectifiers

Number of Phases  

1

Rep Pk Reverse Voltage-Max  

50 V

Non-rep Pk Forward Current-Max  

125 A

Voltage - Peak Reverse (Max)  

50 V

Breakdown Voltage-Min  

55 V

Product Category  

Bridge Rectifiers