Surface Mount  

YES

Package / Case  

Module

Supplier Device Package  

-

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

GC4702-115-2

Rohs Code  

Yes

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

O-XDFM-F2

Manufacturer Package Code  

CASE 115-2

Risk Rank  

5.71

Number of Elements  

1

Operating Temperature-Max  

150 °C

Package Body Material  

UNSPECIFIED

Package Shape  

ROUND

Package Style  

FLANGE MOUNT

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature (Max.)  

150C

Operating Temperature Classification  

Military

Typical Carrier Life time  

0.01(ns)

Series Resistance @ Maximum IF  

1.2@10mA(ohm)

Rad Hardened  

No

Operating Temperature (Min.)  

-55C

Applications Frequency Range  

Ku

Mounting  

Screw

Package  

Tray

Mfr  

Microchip Technology

Power Dissipation (Max)  

3 W

Product Status  

Active

Operating Temperature  

-55°C ~ 150°C

Series  

-

ECCN Code  

EAR99

Type  

Attenuator

Applications  

LIMITER

HTS Code  

8541.10.00.80

Terminal Position  

DUAL

Terminal Form  

FLAT

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

2

JESD-30 Code  

O-XDFM-F2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Diode Type  

PIN DIODE

Capacitance @ Vr, F  

0.3pF @ 6V, 1MHz

Reverse Voltage  

20(V)

Voltage - Peak Reverse (Max)  

20V

Breakdown Voltage-Min  

20 V

Frequency Band  

KU BAND

Diode Capacitance-Nom  

0.5 pF

Resistance @ If, F  

1.2Ohm @ 10mA, 100MHz

Minority Carrier Lifetime-Nom  

0.01 µs

Diode Res Test Current  

10 mA

Diode Forward Resistance-Max  

1.2 Ω