Surface Mount  

NO

Mount  

Through Hole

Package / Case  

Axial

Number of Pins  

2

Supplier Device Package  

Axial

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

UM9701

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

HERMETIC SEALED, GLASS PACKAGE-2

Risk Rank  

5.32

Number of Elements  

1

Operating Temperature-Max  

175 °C

Operating Temperature-Min  

-65 °C

Package Body Material  

GLASS

Package Shape  

ELLIPTICAL

Package Style  

LONG FORM

Power Dissipation (Max)  

0.5 W

Reflow Temperature-Max (s)  

NOT SPECIFIED

Factory Pack QuantityFactory Pack Quantity  

1

Brand  

Microchip Technology

RoHS  

N

Package  

Tray

Mfr  

Microchip Technology

Product Status  

Active

Packaging  

Bulk

Operating Temperature  

-65°C ~ 175°C

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Type  

Switch

Terminal Finish  

TIN LEAD

Applications  

SWITCHING

Additional Feature  

LOW DISTORTION

HTS Code  

8541.10.00.80

Max Power Dissipation  

2.5 W

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

JESD-30 Code  

E-LALF-W2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Element Configuration  

Single

Diode Type  

PIN DIODE

Case Connection  

ISOLATED

Product Type  

PIN Diodes

Capacitance @ Vr, F  

1.8pF @ 50V, 1MHz

Voltage - Peak Reverse (Max)  

100V

Breakdown Voltage-Min  

100 V

Reverse Test Voltage  

100 V

Diode Capacitance-Nom  

1.8 pF

Resistance @ If, F  

800mOhm @ 10mA, 100MHz

Diode Capacitance-Max  

1.8 pF

Minority Carrier Lifetime-Nom  

1.5 µs

Diode Res Test Current  

10 mA

Diode Res Test Frequency  

100 MHz

Diode Forward Resistance-Max  

0.8 Ω

Product Category  

PIN Diodes

Radiation Hardening  

No