Surface Mount  

NO

Mounting Type  

Through Hole

Package / Case  

B, Axial

Supplier Device Package  

B, Axial

Diode Element Material  

SILICON

Number of Terminals  

2

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

MICRO MINIATURE, GLASS PACKAGE-2

Risk Rank  

5.18

Number of Elements  

1

Operating Temperature-Max  

200 °C

Package Body Material  

GLASS

Package Shape  

ROUND

Package Style  

LONG FORM

Power Dissipation (Max)  

0.5 W

Reference Voltage-Nom  

9.1 V

Reflow Temperature-Max (s)  

NOT SPECIFIED

Manufacturer Part Number  

1N6323

Rohs Code  

No

Package  

Bulk

Base Product Number  

1N6323

Impedance (Max) (Zzt)  

6 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Unit Weight  

0.005291 oz

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

Through Hole

Brand  

Microchip Technology

RoHS  

N

Operating Temperature  

-65°C ~ 175°C (TJ)

Series  

-

Packaging  

Bulk

Tolerance  

±5%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.50

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Reference Standard  

MIL-19500/533

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

1 µA @ 7 V

Power Dissipation  

500

Voltage - Forward (Vf) (Max) @ If  

1.4 V @ 1 A

Case Connection  

ISOLATED

Power - Max  

500 mW

Voltage - Zener (Nom) (Vz)  

9.1 V

Product Type  

Zener Diodes

Voltage Tol-Max  

5%

JEDEC-95 Code  

DO-35

Working Test Current  

20 mA

Dynamic Impedance-Max  

6 Ω

Product Category  

Zener Diodes