Surface Mount  

NO

Package / Case  

A-Package-2

Mounting Type  

Through Hole

Supplier Device Package  

-

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

UES1104

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

1.87

Number of Elements  

1

Package Body Material  

GLASS

Package Shape  

ROUND

Package Style  

LONG FORM

Reflow Temperature-Max (s)  

NOT SPECIFIED

Vr - Reverse Voltage  

200 V

Ir - Reverse Current  

10 uA

Maximum Operating Temperature  

+ 150 C

Minimum Operating Temperature  

- 55 C

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

Through Hole

Brand  

Microchip Technology

If - Forward Current  

1 A

RoHS  

N

Package  

Bulk

Base Product Number  

UES1104

Mfr  

Microchip Technology

Product Status  

Active

Packaging  

Bulk

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

Type  

Fast Recovery Rectifiers

Terminal Finish  

TIN LEAD

Applications  

EFFICIENCY

HTS Code  

8541.10.00.80

Subcategory  

Diodes & Rectifiers

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Speed  

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type  

RECTIFIER DIODE

Current - Reverse Leakage @ Vr  

10 µA @ 200 V

Voltage - Forward (Vf) (Max) @ If  

1.25 V @ 1 A

Case Connection  

ISOLATED

Operating Temperature - Junction  

-55°C ~ 150°C

Max Surge Current  

20 A

Output Current-Max  

2 A

Voltage - DC Reverse (Vr) (Max)  

200 V

Current - Average Rectified (Io)  

1A

Product Type  

Rectifiers

Number of Phases  

1

Capacitance @ Vr, F  

-

Non-rep Pk Forward Current-Max  

20 A

Recovery Time  

50 ns

Reverse Recovery Time-Max  

0.05 µs

Reverse Recovery Time (trr)  

50 ns

Product  

Rectifiers

Vf - Forward Voltage  

1.15 V

Product Category  

Rectifiers