Surface Mount  

YES

Package / Case  

144-LQFP

Supplier Device Package  

144-TQFP (20x20)

Number of Terminals  

144

Manufacturer Part Number  

M2S005-TQ144I

Rohs Code  

No

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

TQFP-144

Risk Rank  

5.88

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Package Code  

LFQFP

Package Equivalence Code  

QFP144,.87SQ,20

Package Shape  

SQUARE

Package Style  

FLATPACK, LOW PROFILE, FINE PITCH

Supply Voltage-Max  

1.26 V

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

30

Number of I/Os  

84

Package  

Tray

Mfr  

Microchip Technology

Product Status  

Obsolete

Supply Voltage-Min  

1.14 V

Operating Temperature  

-40°C ~ 100°C (TJ)

Series  

SmartFusion®2

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Terminal Position  

QUAD

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

240

Terminal Pitch  

0.5 mm

Reach Compliance Code  

not_compliant

JESD-30 Code  

S-PQFP-G144

Number of Outputs  

84

Qualification Status  

Not Qualified

Power Supplies  

1.2 V

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

-

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Number of Inputs  

84

Seated Height-Max  

1.6 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes  

FPGA - 5K Logic Modules

Number of Logic Cells  

6060

Flash Size  

128KB

Length  

20 mm

Width  

20 mm