Surface Mount  

YES

Mounting Type  

Surface Mount

Package / Case  

3-SMD, No Lead

Supplier Device Package  

UB

Number of Terminals  

3

Transistor Element Material  

SILICON

Manufacturer Part Number  

2N3737UB

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Part Package Code  

SOT

Package Description  

CERAMIC PACKAGE-3

Risk Rank  

5.15

Number of Elements  

1

Operating Temperature-Max  

200 °C

Package Body Material  

CERAMIC, METAL-SEALED COFIRED

Package Shape  

RECTANGULAR

Package Style  

SMALL OUTLINE

Turn-off Time-Max (toff)  

60 ns

Turn-on Time-Max (ton)  

48 ns

Package  

Bulk

Current-Collector (Ic) (Max)  

1.5 A

Base Product Number  

2N3737

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

SMD/SMT

Brand  

Microchip Technology

RoHS  

N

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

-

Packaging  

Waffle

ECCN Code  

EAR99

HTS Code  

8541.21.00.95

Subcategory  

Transistors

Technology  

Si

Terminal Position  

DUAL

Terminal Form  

NO LEAD

Reach Compliance Code  

compliant

Pin Count  

3

JESD-30 Code  

R-CDSO-N3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Power - Max  

500 mW

Transistor Application  

SWITCHING

Polarity/Channel Type  

NPN

Product Type  

BJTs - Bipolar Transistors

Transistor Type  

NPN

DC Current Gain (hFE) (Min) @ Ic, Vce  

20 @ 1A, 1.5V

Current - Collector Cutoff (Max)  

10µA (ICBO)

Vce Saturation (Max) @ Ib, Ic  

900mV @ 100mA, 1A

Voltage - Collector Emitter Breakdown (Max)  

40 V

Frequency - Transition  

-

Collector Current-Max (IC)  

1.5 A

DC Current Gain-Min (hFE)  

20

Collector-Emitter Voltage-Max  

40 V

Product Category  

Bipolar Transistors - BJT