Surface Mount  

YES

Mounting Type  

Surface Mount

Package / Case  

3-SMD, No Lead

Supplier Device Package  

UB

Number of Terminals  

3

Transistor Element Material  

SILICON

Manufacturer Part Number  

2N5115UB

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

SURFACE MOUNT PACKAGE-3

Risk Rank  

5.12

Number of Elements  

1

Operating Temperature-Max  

200 °C

Package Body Material  

CERAMIC, METAL-SEALED COFIRED

Package Shape  

RECTANGULAR

Package Style  

SMALL OUTLINE

Reflow Temperature-Max (s)  

NOT SPECIFIED

Package  

Bulk

Base Product Number  

2N5115

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Brand  

Microchip Technology

RoHS  

N

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

Military, MIL-PRF-19500

Packaging  

Waffle

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Type  

JFET

Terminal Finish  

TIN LEAD

HTS Code  

8541.21.00.95

Technology  

Si

Terminal Position  

DUAL

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

3

JESD-30 Code  

R-CDSO-N3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Operating Mode  

DEPLETION MODE

Power - Max  

500 mW

FET Type  

P-Channel

Input Capacitance (Ciss) (Max) @ Vds  

25pF @ 15V

Drain to Source Voltage (Vdss)  

30 V

Polarity/Channel Type  

P-CHANNEL

Product Type  

JFETs

Drain-source On Resistance-Max  

100 Ω

DS Breakdown Voltage-Min  

30 V

FET Technology  

JUNCTION

Power Dissipation-Max (Abs)  

0.5 W

Feedback Cap-Max (Crss)  

7 pF

Current - Drain (Idss) @ Vds (Vgs=0)  

60 mA @ 15 V

Voltage - Cutoff (VGS off) @ Id  

6 V @ 1 nA

Voltage - Breakdown (V(BR)GSS)  

30 V

Resistance - RDS(On)  

100 Ohms

Product Category  

JFET