Surface Mount  

NO

Mounting Type  

Through Hole

Package / Case  

DO-204AH, DO-35, Axial

Number of Pins  

2

Supplier Device Package  

DO-35

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

1N6309

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Part Package Code  

DO-35

Package Description  

MICRO MINIATURE, GLASS PACKAGE-2

Risk Rank  

5.2

Moisture Sensitivity Levels  

1

Number of Elements  

1

Operating Temperature-Max  

150 °C

Package Body Material  

GLASS

Package Shape  

ROUND

Package Style  

LONG FORM

Power Dissipation (Max)  

0.5 W

Reference Voltage-Nom  

2.4 V

Reflow Temperature-Max (s)  

NOT SPECIFIED

Package  

Bulk

Base Product Number  

1N6309

Impedance (Max) (Zzt)  

30 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

SMD/SMT

Brand  

Microchip Technology

RoHS  

N

Operating Temperature  

-65°C ~ 175°C

Series  

-

Packaging  

Bulk

Tolerance  

±5%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.10.00.50

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Reference Standard  

MIL-19500/533

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

100 µA @ 1 V

Voltage - Forward (Vf) (Max) @ If  

1.4 V @ 1 A

Case Connection  

ISOLATED

Power - Max  

500 mW

Voltage - Zener (Nom) (Vz)  

2.4 V

Product Type  

Zener Diodes

Voltage Tol-Max  

5%

JEDEC-95 Code  

DO-35

Working Test Current  

20 mA

Dynamic Impedance-Max  

30 Ω

Product Category  

Zener Diodes